Publications

• X. Chen, R. P. Dick, and L. Shang, “ Properties of and Improvements to Time-Domain Dynamic Thermal Analysis Algorithms,” in Proc. Design, Automation, & Test in Europe, Mar. 2010. Notes: New temperature update function and step size adaptation method that significantly speed up dynamic thermal analysis.
• N. Allec, Z. Hassan, L. Shang, R. P. Dick, and R. Yang, “ ThermalScope: Multi-scale thermal analysis for nanometer-scale integrated circuits,” in Proc. IEEE/ACM International Conference on Computer-Aided Design, Nov. 2008. Notes: Nominated for best paper award. Unified Boltzmann transport and Fourier heat flow thermal model capable of nanoscale accuracy and efficient enough to handle an entire integrated circuit.
• Y. Yang, Z. P. Gu, R. P. Dick, and L. Shang, “ISAC: Integrated Space and Time Adaptive Chip-Package Thermal Analysis,” in IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems, Jan. 2007. Notes: New temporally and spatially adaptive dynamic and steady-state integrated circuit thermal analysis algorithms that are much faster than conventional approaches (e.g., 170×–476× for dynamic analysis) while maintaining accuracy.
• Y. Yang, C. Zhu, Z. P. Gu, L. Shang, and R. P. Dick, “Adaptive Multi-Domain Thermal Modeling and Analysis for Integrated Circuit Synthesis and Design,” in Proc. Int. Conf. Computer-Aided Design, pp. 575–582, Nov. 2006. Notes: Unified steady-state, time-domain, and frequency-domain adaptive thermal analysis system using adaptation to speed up analysis by orders of magnitude while preserving accuracy.
• Y. Yang, Z. P. Gu, C. Zhu, L. Shang, and R. P. Dick, “Adaptive Chip-Package Thermal Analysis for Synthesis and Design,” Proc. Conf. on Design, Automation, and Test in Europe, March 2006. Notes: New temporally and spatially adaptive dynamic and steady-state integrated circuit thermal analysis algorithms that are much faster than conventional approaches (e.g., 170×–476× for dynamic analysis) while maintaining accuracy.